Payment service provider Due completes US$3.3 million in seed round financing, led by Semantic and Fabric Ventures
On November 7th, payment service provider Due completed a $3.3 million seed round of financing, co-led by Semantic and Fabric Ventures, with participation from BlockTower, Speedinvest, Polymorphic Capital, and Discovery Ventures. This round of financing will be used to further develop Due's technology and expand its legal currency connections to more markets. It is reported that Due was founded in 2022 and is currently building a platform that connects domestic payment channels using open and interoperable blockchain protocols. Due is set to launch in November 2023 and is currently targeting the United States, Europe, the United Kingdom, and Sub-Saharan Africa, with plans to expand to Latin America and the Asia-Pacific region in the first quarter of next year.
Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.
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